FUJIFILM Corporation announced that its U.S.-based subsidiary for semiconductor materials, FUJIFILM Electronic Materials U.S.A., Inc. (Fujifilm), will participate in SEMICON West 2026, an international exhibition of semiconductor manufacturing equipment and materials, to be held in San Francisco, CA, from October 13-15, 2026.
At the exhibition, Fujifilm will highlight its CMP Materials and the ZEMATES family of photoresist insulating films for advanced packaging applications. Fujifilm will also highlight PFAS-free products such as negative-type immersion ArF resists and PBO (polybenzoxazole) developed in accordance with environmental standards and customer requests.
Fujifilm offers a “one-stop solution” for advanced semiconductor manufacturers and a broad portfolio of materials spanning multiple stages of the manufacturing process. These include Photoresists & Ancillaries, Image Sensor Materials, CMP Materials, Packaging Materials, Thin Film Systems, Cleaners & Etchants, Process Chemicals, and Ultra Pure Solvents.
“Driven by growing demand for AI, advanced computing, and data-intensive applications, the semiconductor industry continues to invest heavily in both manufacturing capacity and next-generation process technologies,” said Brian O’Donnelly, president & CEO, FUJIFILM Electronic Materials U.S.A., Inc. and corporate vice president, FUJIFILM Corporation. “This growth is fueling demand for high-performance materials across the semiconductor manufacturing process.”
Fujifilm supports semiconductor customers in the United States through its manufacturing sites located in Arizona, Colorado, Rhode Island, and Texas. By combining local production and technical support in development, manufacturing, and quality assurance, Fujifilm helps customers advance innovation while ensuring a stable and reliable supply of critical semiconductor materials. This model has been particularly important in supporting leading-edge semiconductor production, including CMP slurry technologies that enable precise wafer planarization.
